AMADEUS Seminar - Prof. Oren Regev, - Thursday 3 october 2019, 10:30 am - CRPP (Amphi)

Abstract

The miniaturization, integration and compatibilization of electronic devices dictate the need for efficient thermal management to prevent heat accumulation, which may reduce the operation speed and shorten their life time. Addressing this challenge requires the development of novel polymer-based composite materials with enhanced thermal conductivity. Here, we report a compression-based approach for the preparation of polymer composites loaded with carbon-based hybrid fillers, i.e., graphene nanoplatelets and graphite flakes. The carbon-based fillers contribute significantly to the thermal conductivity of the composite while boron nitride nanoparticles provide the desirable inhibition of the electrical conductivity to avoid short circuits. An optimal thermal conductivity of up to 27.5 W·(m·K)^-1 is obtained for epoxy polymer loaded with graphene nanoplatelets and graphite flakes compared to 0.2 W·(m·K)^‑1 of the neat thermoset polymer.